AMAT 3750-01112｜Original Spare Parts For Semiconductor Equipment｜

AMAT 3750-01112 – Spare Part Overview

1. Adaptation to Device Types

The AMAT 3750-01112 spare part is primarily applied in two categories of semiconductor production equipment, where it directly impacts wafer process accuracy:

• Thin Film Deposition Equipment

  • PVD (Physical Vapor Deposition): for metal thin film deposition.

  • CVD (Chemical Vapor Deposition): for insulating and semiconductor thin film deposition.

  • In these applications, the 3750-01112 typically functions as a process gas control interface or vacuum pipeline pressure signal feedback module, ensuring stable gas flow and pressure. This stability is critical for maintaining uniform thin film thickness.

• Etching Equipment

  • Used for wafer patterning processes such as circuit etching.

  • In this context, the 3750-01112 serves as a signal transmission component for etchant delivery systems, helping prevent deviations in etching patterns caused by fluctuations in etching rates.

2. Core Functions (Based on AMAT 3750 Series Characteristics)

Due to AMAT’s policy on proprietary technical disclosures, specific details of original spare parts depend on equipment model configurations. However, the 3750-01112 shares the following common functional categories within the 3750 series:

• Fluid Control Assistance

  • Acts as an interface or regulating element in process fluid pathways (gas/liquid).

  • Ensures leak-free delivery and precise flow control by connecting valve groups and sensors.

• Signal Transmission Adaptation

  • Provides low-latency signal transfer between device subsystems (controllers, sensors, actuators).

  • Enables real-time adjustments to key process parameters (e.g., pressure, temperature), ensuring stable and repeatable wafer processing performance.